SHANGHAI: Semiconductor Manufacturing International Corp (SMIC) will build a US$2.35bil (RM9.66bil) plant with funding from the government of Shenzhen, the first major project to emerge from China’s masterplan to match the United States in advanced chipmaking.
SMIC has agreed to a joint venture with the southern municipality in which it will develop and operate a chipmaking plant that can produce silicon of 28 nanometers or above, it said in a stock exchange filing. The partners aim to draw third-party investment, begin production by 2022 and eventually produce 40,000 12-inch wafers a month.