LONDON: Mergers and acquisitions (M&As) are already padding the debt pipeline for 2021, adding momentum to a pace of bond sales that’s slowed from a blistering start to the new year.
LafargeHolcim Ltd and AmerisourceBergen Corp are among the latest to announce deals that will be financed with debt, echoing similar plans from Centene Corp and Teledyne Technologies Inc earlier in the week. The disclosures come after nearly US$50bil of new high-grade offerings kicked off 2021, more than double some estimates.
Already a subscriber? Log in.
Limited time offer:
Just RM5 per month.
Cancel anytime. No ads. Auto-renewal. Unlimited access to the web and app. Personalised features. Members rewards.
Follow us on our official WhatsApp channel for breaking news alerts and key updates!