Econframe signs IPO deal with M&A

'The drive for this listing exercise is to strengthen our brands presence, stature and corporate profile, entrench our market position as a total door systems solution provider as well as funding our future business plans,' said Econframe MD Lim Chin Horng (second from right)

KUALA LUMPUR: Total door system solution provider Econframe Bhd has entered into an underwriting agreement with M&A Securities Sdn Bhd in conjunction with its upcoming initial public offering (IPO) on the ACE Market of Bursa Malaysia Securities Bhd.

A statement said Econframe’s IPO exercise entails a public issue of 65 million new shares and an offer for sale of 32.50 million existing shares.