From left: Techbond Group Bhd managing director Lee Seng Thye exchanging documents with Public Investment Bank Bhd Deputy CEO and Head of Corporate Finance and Advisory Lee Yo-Hunn after the signing of underwriting agreement for Techbond
KUALA LUMPUR: Techbond Group Bhd
plans to raise RM39.67mil from the issuance of new shares ahead of its listing on the Main Market of Bursa Malaysia.
According to its prospectus which was issued on Tuesday, it is issuing 60.10 million new shares at an issue price of 66 sen each.
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