KUALA LUMPUR: Electronic packaging and interconnect solutions provider Amlex Holdings Bhd aims to broaden its electronic packaging and interconnect solutions for the automotive industry after listing on Bursa Malaysia’s LEAP Market.
Co-Founder and Managing Director Lim Say Soon said the company sees great opportunities for its expertise and manufacturing process following the integration and usage of more electronics in the automotive sector.
“We believe demand for automotive lighting products will be positive given the regulations requiring the installation of daytime running lights for new passenger and commercial vehicles in the European Union, the United Kingdom and Canada,” he said in a statement today.
AMLEX made its debut on the LEAP Market of Bursa Malaysia Securities Bhd this morning.
Under the listing exercise, Amlex raised RM6.03 million via a private placement of 40.2 million shares in Amlex at RM0.15 per share to sophisticated investors.
Of the total proceeds raised, RM3.20 million will be utilised for capital expenditure, RM1.03 million for general working capital requirements, RM0.8 million for research and development, while the remaining RM1.0 million will be used for the listing expenses.
Lim said the company would invest RM300,000 to build a new in-house designed rack plating machine, which was estimated to have a plating capacity of 400,000 units per month.
“The new rack plating line will enable Amlex to plate piece part lead frames, using nickel and gold, for the high reflectivity LED lightings used in the automotive industry,” he added.
For the financial year ended Mar 31, 2018, Amlex reported a net profit of RM2.20 million and revenue of RM39.30 million. - Bernama