ADVERTISEMENT

Techbond inks IPO underwriting agreement with Public Investment Bank


Techbond Group Bhd managing diretcor Lee Seng Thye (left) and Public Investment Bank Bhd deputy chief executive officer and head of corporate finance and advisory Lee Yo-Hunn (right).

Techbond Group Bhd managing diretcor Lee Seng Thye (left) and Public Investment Bank Bhd deputy chief executive officer and head of corporate finance and advisory Lee Yo-Hunn (right).

KUALA LUMPUR: Techbond Group Bhd has inked an underwriting agreement (UA) with Public Investment Bank Bhd (PIVB) for its initial public offering (IPO) exercise en route to its listing on the Main Market of Bursa Malaysia Securities Bhd (Bursa Securities) by year-end.

In a statement today, Techbond, an industrial adhesives and sealants manufacturer, said PIVB would underwrite a total of 17.20 million shares made available for the Malaysian public, the group’s eligible employees, and other persons who have contributed to the success of the group.

   

ADVERTISEMENT