People queueing in line to renew their passports at the Home Affairs Ministry Kuala Lumpur Federal Territory (KL FT) Complex at Jalan Duta yesterday.
KUALA LUMPUR: Datasonic Group Bhd
has clinched a RM318.75mil contract from the Government for the supply of Malaysian passport chips.
In a filing with Bursa Malaysia, Datasonic said its wholly owned subsidiary, Datasonic Technologies Sdn Bhd (DTSB), had accepted the letter of award (LOA) from the Home Affairs Ministry for the supply of passport chips.
The contract is for a period of five years from Dec 1, 2016 to Nov 30, 2021 for the provision of 12.5 million passport chips.
Under the terms of the LOA, DTSB is required to furnish a performance bond for the amount of RM3.18mil to the ministry, with validity period from Dec 1, 2016 to Nov 30, 2022.
Datasonic said the contract was expected to contribute positively towards the future earnings and net assets per share of Datasonic group for the financial year ending March 31, 2016 and the financial years thereafter for the duration of the contract.
The company secured a five-year contract through an open tender to supply 10 million new passport polycarbonate datapages with laser engraving personalisation equipment to the Immigration Department from February 2013 to January 2018.
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