KUALA LUMPUR: TA Securities Holdings Bhd has been appointed as lead underwriter for Aemulus Holdings Bhd
's proposed initial public offering (IPO) on the ACE Market of Bursa Malaysia Securities.
The company had on Wednesday signed an underwriting agreement with TA Securities where it would be the group’s principal adviser, sponsor, managing underwriter, joint underwriter and joint placement agent for the IPO.
Aemulus, an electrical and electronics engineering company in the semiconductor tester industry, said on Wednesday that Affin Hwang Investment Bank Bhd would be acting as the other joint placement agent and as joint underwriter along with Mercury Securities Sdn Bhd and M&A Securities Sdn Bhd.
Aemulus executive director and CEO, Ng Sang Beng said the appointment of TA Securities as managing underwriter marks another step forward in our listing process, and the culmination of the hard work of the management team here at Aemulus.
“TA Securities brings a wealth of experience which will be invaluable as we continue towards our IPO,” he said.
Aemulus’ proposed IPO involves a public issue of 87.79 million new 10 sen shares and an offer for sale of 43.89 million existing shares
Under the 87.79 million new shares offered for sale, it said 21.94 million shares would be offered to the public, 13.17 million shares for application by eligible directors, employees and the group’s business associates while the remaining 52.68 million shares would be placed out to selected investors.
Under the offer for sale of 43.89 million existing shares, they would be placed out to investors.
TA Securities executive director of operations, Tah Heong Beng said Aemulus was a leading player in the automated tester equipment (ATE) sector with an industry revenue share of 19.7% in the financial year ended Sept 30, 2013.
Aemulus’ core activities are the design, engineering and development of ATE which are used by semiconductor manufacturers and outsourced semiconductor assembly and test companies to test semiconductor wafer and packaged devices.
The products will then be shipped for final assembly into various electronic devices and gadgets such as mobile phones, tablets, wireless routers and other wireless-enabled products.
