KUALA LUMPUR: Semi-conductor packaging and test service provider, Unisem Bhd, is eyeing a 10% increase in revenue for the second half of this year.
Group chief operating officer Lee Hoong Leong said the rosy outlook is supported by strong global demand for its products such as wafer bumping, wafer-level chip-scale packaging (WLCSP) and radar frequencies devices, used in smartphones and the automotive segments.
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