D&O Ventures Bhd plans to leverage on its key strengths – product and technology innovation, good process and equipment design, and cost optimisation – to position itself as a premier contract manufacturer and assembler of semiconductor products in the next three years.
“Our vision is to become the number one solutions provider in discrete and opto packaging assembly,” group managing director Tay Kheng Chiong told StarBiz.
Already a subscriber? Log in.
Limited time offer:
Just RM5 per month.
Cancel anytime. No ads. Auto-renewal. Unlimited access to the web and app. Personalised features. Members rewards.
Follow us on our official WhatsApp channel for breaking news alerts and key updates!
