China firms seek tie-up with locals

  • Business
  • Tuesday, 15 Jun 2004

By David Tan in Penang

FOUR leading manufacturers of electronic and telecommunication devices from China are interested to establish joint-venture manufacturing operations with local partners in Malaysia.  

China Council For Promotion of International Trade project manager Ma Lei told StarBiz yesterday the four were medium-sized companies that were interested in servicing the manufacturing needs of Chinese companies and multinational corporations operating in Malaysia and in the region.  

He said presently there were only a handful of Chinese companies in Malaysia providing such services.  

Ma Lei

The four companies are Jiangsu Highstar Chemical Power Source Co. Ltd, Ningbo Zhifrancis Telecommunications Equipment Co. Ltd, Shenzhen Ssu Kai Import & Export Co. Ltd, and Xiamen Hongmei Electronic Co Ltd. 

He said the companies had identified Malaysia because the business culture over here is similar to that in China.  

“Furthermore, Malaysians can speak a variety of languages that are widely used in the region. The manufacturing operations they are looking to set up need not be in Penang,” Ma added. 

Ma is the head of the delegation comprising some 20 Chinese companies participating in the 7th Nepcon/Microelectronics Penang 2004 organised by Reed Exhibitions Sdn Bhd, which will be held at the Penang International Sports Arena (PISA) from June 15 to 18. 

At a press conference earlier, Reed Exhibitions general manager Steven Thong said some 292 electronics companies from Europe and Asia would take part in the event.  

“The 292 companies are from countries such as Belgium, Brunei, Canada, China, Denmark, France, Germany, Hong Kong, India, Indonesia, Italy, Japan, Korea, Malaysia, New Zealand, Philippines, Singapore, Sweden, Switzerland, Taiwan, Thailand, Britain, the United States, and Vietnam. 

“They will exhibit the most comprehensive materials, equipment, systems, and services for printed circuit boards, semiconductor packaging, production, design, test, and assembly. Electronic components such as connectors, parts and assemblies will also be included,” Thong said. 

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