Telekom plans RM4b bond issue to buy Celcom


Telekom Malaysia Bhd will raise up to RM4bil via a bond issue to fund its takeover of mobile network operator Celcom Malaysia Bhd, according to primary markets and debt markets newspaper BasisPoint. 

The bond issue will replace the RM4bil bridging loan that Telekom is believed to have put in place for its Celcom offer, according to the BasisPoint report.  

Win a prize this Mother's Day by subscribing to our annual plan now! T&C applies.

Monthly Plan

RM13.90/month

Annual Plan

RM12.33/month

Billed as RM148.00/year

1 month

Free Trial

For new subscribers only


Cancel anytime. No ads. Auto-renewal. Unlimited access to the web and app. Personalised features. Members rewards.
Follow us on our official WhatsApp channel for breaking news alerts and key updates!
   

Next In Business News

Oil falls on prospect of higher-for-longer US rates
Chin Hin taps Ajiya for two-year RM250mil loan
MI Technovation posts three-fold surge in net profit
Wellness a top priority
InNature diversifies into the F&B industry
Tolerance for a cheaper yuan may be temporary
Yinson’s RM16bil debt too big to ignore
Leap in operating income for UOB’s retail banking
Paramount emerges as major shareholder in EWI
China’s push for greener aluminium hit by erratic rains, power cuts

Others Also Read